Product Description
We have marked a successful niche in the market as a famous company engaged in offering SPS BisSodium Sulfopropyl Disulfide. This powder is prepared in accordance with set safety norms using best quality compounds. Widely demanded in the market, this powder is used in preparation of animal feed additives. We use moisture proof materials to pack this SPS Bis-Sodium Sulfopropyl Disulfide and store at our capacious warehouses.
Specifications:
- CAS No.: 27206-35-5
- Molecular formula: C6H12O6S4(Na)2
- Assay: 90, 97
- Appearance: White or yellowish powder
Application: As a brightening agent for acid copper baths for decorative and functional deposits, it is functionally compatible with most components of typical copper bath formulation such as non-ionic surfactants, polymeric amines and other mercapto compounds.
Key Properties and CompositionBis-Sodium Sulfopropyl Disulfide (SPS) is recognized for its high purity (98%) and remarkable solubility in water. With a stable pH ranging from 6.0 to 8.0 and operational temperature tolerance between 15-30C, SPS remains stable during storage and electroplating processes. This additive appears as an odorless white to off-white powder and is shipped in industrial-grade 25 kg drums, ensuring both efficiency and safety in handling.
Applications in ElectroplatingSPS is extensively utilized in acid copper plating baths due to its ability to enhance the gloss, uniformity, and mechanical properties of electroplated copper deposits. It plays a vital role in modern electroplating industries, especially where high-quality finishes are required. Its easy solubility and consistent performance make it a preferred choice for manufacturers, exporters, and suppliers in India and abroad.
FAQs of SPS Bis-Sodium Sulfopropyl Disulfide:
Q: How is SPS Bis-Sodium Sulfopropyl Disulfide used in electroplating processes?
A: SPS is commonly incorporated into acid copper plating baths as a brightener additive. It helps produce finer-grained, smoother, and more uniform copper deposits by modulating the electrochemical reduction of copper ions during plating.
Q: What benefits does SPS provide in electroplating applications?
A: The main advantages include enhanced brightness, improved deposit leveling, reduced pitting, and increased bath efficiency. It also contributes to improved physical and mechanical properties of plated surfaces, ensuring high-quality finishes.
Q: When should SPS be added to the electroplating bath, and what concentration is recommended?
A: SPS should be added to the electrolyte at the initiation of the plating process and periodically thereafter to maintain optimal concentration. The recommended concentration depends on the specific application, but generally falls within the range specified by bath formulation guidelines.
Q: Where should SPS Bis-Sodium Sulfopropyl Disulfide be stored to maintain stability and shelf life?
A: To ensure product stability and a shelf life of up to two years, SPS should be stored in tightly closed containers in a cool, dry environment away from direct sunlight and moisture.
Q: What is the process for handling and dissolving SPS in water?
A: As an easily water-soluble powder, SPS can be dissolved by slowly adding it to the plating bath with continuous stirring to ensure even distribution and full dissolution, avoiding clumping and ensuring effectiveness.
Q: How does SPS Bis-Sodium Sulfopropyl Disulfide contribute to the overall electroplating process?
A: SPS acts as a key additive that refines copper deposit structure, minimizes defects, and boosts the operational efficiency of acid copper plating baths, resulting in superior product appearance and consistency.