Call Me Free Offline
86-27-85583407
Home » Products » Electroplating Intermediates for Copper Plating

Electroplating Intermediates For Copper Plating

2-Mercapto Thiazoline Powder
close
2-Mercapto Thiazoline Powder
H1
CAS No.: 96-53-7 Trade name: H1 Chemical name: 2-mercapto thiazoline Molecular formula: C3H5NS2 Assay: 98% Appearance: White needle crystal Melting point: 105-106°C Application: It is used as main component of additive for acidic copper plating.Good brightness and level result can be obtained.
Price : 30-35 USD ($)
Q75 (N,N,N'N'-tetra(2-hydropropyl)ethylene Diamine
close
Q75 (N,N,N'N'-tetra(2-hydropropyl)ethylene Diamine
EDTP
Supply Ability : 500000 Per Year
Price Range : 1.00 - 1000.00 USD ($)
UPS 3 Amidinothio-1-Propanesulfonic Acid
close
UPS 3 Amidinothio-1-Propanesulfonic Acid
UPS
DPS N,N-Dimethyl-Dithiocarbamylpropyl Sulfonic Acid Sodium Salt
close
DPS N,N-Dimethyl-Dithiocarbamylpropyl Sulfonic Acid Sodium Salt
DPS
SPS Bis-Sodium Sulfopropyl Disulfide
close
SPS Bis-Sodium Sulfopropyl Disulfide
SPS
ZPS 3 Benzothiazolyl-2-mercapto Propylsulfonate Sodium Salt
close
ZPS 3 Benzothiazolyl-2-mercapto Propylsulfonate Sodium Salt
ZPS


Back to top